Soic package. Features of SOIC-8 Package.

Soic package D (SOIC) and NS (SO) are the package drawing codes, NOT the part suffixes! M is the part suffix for SOIC, NS for SO. This industry-standard package runs in very-high volume and provides value-added, low-cost solutions for a wide range of applications. Migration Considerations 1. Aug 3, 2020 · TSMC’s 3DFabric family of technologies consists of both 2D and 3D frontend and backend interconnect technologies. 6. 縮寫詞SOIC,有兩個常用的拼法。其一是Small Outline Integrated Circuit Package,小外形積體電路封裝;其二是Svenska Ostindiska Companiet,瑞典東印度公司。下面分別磁隔離. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL METAL Oct 28, 2020 · soic-8 的焊盘宽度是 0. 150 0. 5mm pads , 6. devices. Jul 13, 2015 · When creating a footprint for a SOIC, it’s important to recognize that they can differ based on the package’s body size, pad span, pitch of leads, and so on. Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). SOP packages typically have a smaller lead spacing SOIC vs. SOIC, whose full name is Small Outline Integrated Circuit, is a type of chip package designed to replace the traditional DIP (Dual In-line Package). There are some slight variations between specifications of the SOIC and MSOP. The resulting integrated chip outperforms the original SoC in system performance. Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), SC70, etc. Join the GrabCAD Community today to gain access and download! Jul 31, 2008 · Package Outline Drawing Package Code:DCG8D4 8-SOIC 4. High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. 78mm = 2. We use gold plated interconnects for our pin and through hole converters. 050" lead spacing and typically come in lead counts ranging from 8-24 leads and have a Gullwing lead configuration. the package top may be smaller than the package bot tom. 3 x 14 mm. These technologies include our Chip-on-Wafer (CoW) and The ' Small Outline J-Lead Package', or SOJ, is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. This article explores the various classifications of IC packages, each tailored to specific requirements and applications. Features of SOIC-8 Package. 3D model(. 75mm height Package Drawing - SO 16-Lead Plastic (Narrow . 8w次，点赞27次，收藏132次。1. Like other surface-mount ICs, SOIC is mounted on the surface of a PCB using SMT (Surface Mount Technology), featuring a smaller footprint and higher pin density. ICパッケージの種類代表的なICのパッケージの一覧です。IC選択時の参考にしてください。半導体の商品一覧はこちら端子方向実装型端子形状代表的なイメージ略称正式名称概要 1方向挿入実装型直線状 SIP Single In-line Package パッケージの長辺 Oct 26, 2021 · bga qfn qfp sop soic sot ssop芯片常用封装 altium ad元件库 pcb封装库（ad库）包括bga qfn qfp sop soic sot ssop 芯片pcb封装。pcblib后缀文件，共计484个封装,均是ad标准封装文件，可以直接应用到你的项目设计中 Dec 13, 2022 · IC Package Types. 9 x 1. 8 mm (narrow body) and 300 mils or 7. 27mm，如下：上面两种规格主要是针对8P的，常用的14P Oct 10, 2020 · 圖四、台積電的 SoIC、CoWoS、InFO 技術圖示 (圖片來源：台積電官網) 當 SoIC 可商品化並運用到終端裝置中，的確會像台積電董事長劉德音所說：「未來半導體的技術發展，必須跳脫奈米製程節點的陳述。」、「假使你擔心 7nm、5nm、1nm 這些數字的進展，那就錯了。 SOIC: 429Kb / 3P: Surface Mount SOIC Resistor Networks TT Electronics. 따라서 두 패키지는 비슷한 형태이지만 두께와 높이에서 차이가 있습니다. They are generally available in the same pin-outs as their counterpart DIP ICs. SOIC packages have a smaller overall height compared to other packages, allowing for more compact circuit designs. 45 - 0. - SOIC는 미국 JEDEC 규격에 따른 SOP의 다른 이름. SOIC 8 Cu Package Type J/ A (C/W) 0 10 20 30 40 50 60 1s 2s2p % Shift 216 108 % Shift. QFP에 반해 2방향인 SOP는 회로의 규모가 크지 않을 때 사용한 다. SOIC. They can have a few different variants: SSOP Packages: SSOPs, or shrink small outline packages, have a pin pitch of 0. When you don't need something with as much storage as a micro SD card, but an EEPROM is too small, SPI (or QSPI) Flash chips give you on-the-order-of PACKAGE OUTLINE, SOIC,300 Rev F: Integrated Circuit Syst MK2761A: 142Kb / 6P: Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. xml)：Land pattern Data in JEITA LPB C-format TSMC-SoIC service platform provides innovative front-end, 3D inter-chip (3D IC) stacking technologies for re-integration of chiplets partitioned from System on Chip (SoC). COMPLIANT TO JEDEC STANDARDS MS-012-AA 012407-A 0. 65mm for narrow versions Debido a que SOIC es fermiónico (silicio comercial, mezclado con semiconductores), existen dos tipos de chips SOIC: SOIC comercial y SOIC híbrido. Below, you are going to read the most common types of packages in easy language. Note that the pin pitch is the same, but the package body width is different. xml)：Land pattern Data in JEITA LPB C-format Mini Small Outline Package or Micro Small Outline Package (MSOP) is an SOP with a pin pitch of 0. Small-outline IC (SOIC) Small-outline (SOIC) packages are another common type of IC package that is widely used in electronic devices. The standard form is a flat rectangular body, with leads extending from two sides. SOIC는 두꺼운 패키지로 주로 사용되며, SOP는 얇은 패키지를 의미합니다. Apr 29, 2021 · Different types of integrated circuit packages, Single in-line, Zigzag in-line, Dual in-line, Quad in-line, Ceramic flat pack, Surface-mount small-outline, Surface-mount leadless, Flat pack, Chip carrier, Chip scale, Grid array In packages with a pin pitch of 1. 08 0. Aber ich weis eben nicht sicher ob die das sind. SOP Packages. 75 mm). 1s vs 2s2p PCB for Various Packages As shown, as much as a 50% R. In terms of cost, DIP packages are generally less expensive than SOIC packages. The ISO772x family of devices is available in 16-pin SOIC wide-body (DW), 8-pin SOIC wide-body (DWV), and 8-pin SOIC narrow-body (D) packages. 磁耦採用的標準封裝:SOIC-8、SOIC_W-16及SOIC_W-20等。磁隔離易用性磁耦的小體積及多種通道配置,是 The SOIC family provides small surface mount IC packages in standard widths similar to common through-hole DIP packages: SOIC-8 to SOIC-28 – Narrow versions with 0. 4. But just to be clear for the OP, these are just TI’s codes, not any kind of industry standard. Different manufacturers use different designations: Analog Devices uses the term micro SOIC, Maxim uses SO/uMAX, and National Semiconductor uses MiniSO. SOIC belongs to the SOP package family. 27mm pitch, 1. SOIC is available in a variety of 8-Pin packages (MSOP, PDIP, and SOIC) and is ideal for applications requiring small size and low power. Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. QSOP. In general, the choice of a package comes down to size (MSOP is smaller, and needs a smaller footprint on the PCB), versus absolute best performance (SOIC We would like to show you a description here but the site won’t allow us. Jul 30, 2020 · The SOT-23 package is used in high-power SMT transistors with four or more pins and measures up to 6. xml)：Land pattern Data in JEITA LPB C-format Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order TSMC-SoIC ® services include the custom manufacturing of semiconductors, memory chips, wafers, integrated circuits, product research, custom design and testing for new product development, along with technology consultation services for electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafers, and integrated circuits. Aug 10, 2001 · SOIC Package 또한 뒤에 Pin 번호를 붙여서 부르기도 합니다. 194 0. For integrated circuits (or ICs), the common types are the quad flat package (QFP), small outline integrated circuit (SOIC), ball grid array (BGA), and plastic leaded chip carrier (PLCC). The leads protrude from the longer edge of the package. 27mm Pitch. 3. The convention for naming the package is SOIC or SO followed by the number of pins. 6 mm. SOP和SOIC的规格多是类似的，现在大多数厂商基本都采用的是SOIC的描述：SOIC8有窄体150mil的（外形封装宽度，不含管脚，下同），管脚间距是1. May 18, 2023 · when i’m having a difficult time figuring out the package/footprint i usually start with digikey. なお、SOICは『 SOL(Small Outline L-leaded package) 』や『 SO 』と表記されることもあります。『SOP』と『QFP』の違いガルウィング形(L字形) のリードがパッケージの 2側面から出ているか、 4側面から出ているかでパッケージ名称が変わります。 The SOIC package is a rectangular "Dual In-line" style ceramic package. 6 %âãÏÓ 280 0 obj >stream hÞ¬”Ýjã0 …_Eo`iFò ”\4»ÍE)„Úw¡,! M ƒãBöí÷Èò »Pvé GÇž3ú$yäŒ5NŒ+ *# A ãEÌÝ]qÿ ãþ¾¿n‚7Î SOIC Configuration Options SOIC Nominal Package Dimensions (Inches) Package Type Lead Count Body Width Body Length Body Thickness Standoff Overall Height Lead Pitch Tip-to-Tip JEDEC SOIC (Narrow) 8 0. 3. 정확한 의미로 구분지으면 SOIC 안에 SOP와 SOJ가 있다고 보는게 맞습니다. SoIC InFO_B SoC TSMC-SoICTM + InFO_oS HBM HBM TSMC-SoICTM + CoWoS® SoIC SoIC 3DFabrics updates- additional structures, Packaging Envelop Increase and SoIC Pitch Scaling Advanced Packaging 3D Chip Stacking (SoIC) + Advanced Packaging CoWoS® InFO 3D Chip Stacking (SoIC) + Advanced Packaging Advanced Packaging Integration Technologies Feb 28, 2022 · TSMC의 3D 적층 기술, SoIC. 6 mm nominal (maxi-mum of 1. Material: black conductive or black static dissipative 4. There are non-exposed (normally just referred to as SOIC-x or SOIC-xN) and exposed pad versions (which are normally indicated with an “E” in the package name 6 ). 75 mm Body, 1. SOIC is also sometimes referred to as "SOL (Small Outline L-leaded package)" or "SO". Package converters provide an electrical and mechanical conversion from one package type to another. The small outline integrated circuit has package information stated with the prefix SO. The standard form is a flat rectangular or square body, with leads extending from two or all four sides. 05 - - 0. Integrated Circuit Packages. However, the cost difference may be offset by the advantages of SOIC packages in terms of performance, size, and ease of assembly. It takes up 30-50% less space than an identical dual in-line package (DIP), with a typical thickness of 70% less. 050 0. It also affords the flexibility to integrate additional system functionalities. Jan 20, 2024 · SOP-8（Small Outline Package）和SOIC-8（Small Outline Integrated Circuit）都是常见的集成电路封装类型，它们都具有8个引脚，适用于表面贴装技术。在尺寸和引脚间距上，它们通常非常相似，常见的引脚间距都是1. they seem to (at least try to) have a consistent package naming for parts. they’ll list MFG package (as “Supplier Device Package”) along with Package / Case so you can filter/sort by that package to find compatible parts. 01_00 | Feb 13, 2024 | PDF | 104 kb. 45 = 4. 625 W Rth JA Thermal resistance, junction to ambient 200 °C/W T J Junction temperature 150 T 8 lead SOIC YK(AEBq The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. On SOIC packages, each pin is usually spaced by about 0. The Small Outline Integrated Circuit, or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. 03 mb May 31, 2011 · D Package power dissipation @ TA 25°C 0. Sep 26, 2023 · The second disadvantage is that the SOIC-8 package requires more area on your board, which may reduce the amount of space available for other components. 78mm pads , 6. Camber not to exceed 1 mm in 100 mm, also not to exceed 1. Typical V SOP lead counts range from 8 to 40. 9 x 3. Narrow Body) Maxim Integrated Produc 21-0041: 39Kb / 1P: PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH Rev B: 21-0111: 31Kb / 1P: PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E: RFHIC: AE607: 1Mb / 5P May 30, 2024 · A: SOIC (Small Outline Integrated Circuit) packages are surface-mounted and have a smaller footprint compared to DIP (Dual In-line Package) packages, which are through-hole. Nov 2, 2023 · There are several variations of SOIC packaging, including Small Outline J-Lead (SOJ), Mini Small Outline Package (MSOP), Shrink Small Outline Package (SSOP), and Thin Small Outline Package (TSOP). Small-outline integrated circuit (SOIC) packages are compact, rectangular, “Dual In-line” ceramic packages engineered to fulfill the escalating need for miniaturization and enhanced component density. Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer-level packages. Are there any performance differences between the AD8421 SOIC and MSOP package options? Answer. Dual Inline Package Meaning Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Die SO(IC)-Bauform wurde von der US-amerikanischen Normierungsorganisation JEDEC in zwei verschiedenen Ausführungen standardisiert. 6. Typical VSOP body widths range from 3 mm to 10 SOIC（Small Outline Integrated Circuit Package），小外形集成电路封装，指外引线数不超过28条的小外形集成电路，由 SOP (Small Out-Line Package）封装派生而来，一般有宽体和窄体两种封装形式。其中具有翼形短引线者称为SOL器件，具有J型短引线者称为SOJ器件。 May 21, 2023 · You ask the weirdest questions Is it that hard to look at the recommended footprints and compare them? ex soic has 0. SOIC packages are JEDEC-compliant, and come in a variety of body widths, the most popular of which are 150 mils or 3. . Oct 29, 2024 · Small-Outline IC (SOIC) & Small-Outline Package (SOP) (SOP) Small-outline Package. 85 mm. a SOIC-xN (SOIC narrow)) family of packages is governed by the JEDEC MS-012-AA standard. They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. 1. Standard Pb-free lead finish on these packages is Matte Tin Plating. Evaluating Data Setup and Hold Timing Slack 1. Davon habe ich das Datenblatt und damit auch die Maße. The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Jun 25, 2022 · This chip is available in multiple packages. 65mm，综合对比完全可以互相替换。 · 其他封装简介芯片的封装技术已经历了好几代的变迁，从 dip、qfp、pga、bga到csp再到mcm，技术指标一代比一代先进，包括芯片面积与封装面积之比越来越接近于1，适用频率越来越高，耐温性能越来越好，引脚数增多 Jan 22, 2024 · The "Device Information" box on the first page of the datasheet show that the DW package is 10. 하지만 SOIC Package는 SOJ (Small Outline J-leaded Package) 또한 포함하여 부르는 말입니다. Ironwood Electronics offers solder column adapters as a solution for leaded SMT packages such as QFP, PLCC, SOIC, SSOP, and TSOP. The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package. 1. The SO package was developed in Europe in the mid-1970s particularly for the emerging electronic watch market. 72mm x 1. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. Never trust the manufacturer's package name. 7 mm by 3. 92-31. 3 x 7. In Eagle habe ich Packages, die sich SO08 nennen und verdächtig nach dem SOIC aussehen. The options with the best availability are SOIC8 150mil and SOIC8 208mil. 27mm) / Pin : 8~44 > < Typ. 5mm - 2 x 1. 65mm which is almost half of the SOIC package. Oct 27, 2017 · SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. SOIC와 SOP(Small Outline Package)는 매우 유사하지만, 둘 사이에는 차이점이 있습니다. BGA IC Package. Find out its advantages, use cases, common modifications and comparisons with other packages. SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. What is a SMD Package? It's Features, Types and Sizes. Figure 1-1. SOIC Package 또한 뒤에 Pin 번호를 붙여서 부르기도 합니다. 8 mm. Two of Amkor’s most popular traditional leadframe package types are Small Outline Integrated Circuit (SOIC) and Quad Flat Pack (QFP), also commonly known as “Dual” and “Quad” products. Our frontend technologies, or TSMC-SoIC ® (System on Integrated Chips), use the precision and methodologies of our leading edge silicon fabs needed for 3D silicon stacking. 24 mm Pitch: 2. Greatek specializes in SOP assembly and offers not only in narrow body, but also expanded to wide body SOIC, mini-SOP, Shrink Small-outline Package SOIC, SOT-143, and SOT-23 Packages SOIC PACKAGES (narrow and wide body) Notes 1. Lead pitch: 1. SOIC Package. SOIC packages come in various configurations, typically ranging from 8 to 32 pins. 5. 10 sprocket hole pitch cumulative tolerance ± 0. Find out the advantages, features, standards, and applications of these IC packages. 27mm) from the next. Das JEDEC-Dokument mit dem Namen MS-012 beschreibt eine sogenannte „Narrow“-Version (N), die in der 8-, 14- und 16-Pin-Ausführung eine schmalere Gehäuseform mit einer Breite von ca. 3,9 mm (0,15 Zoll, 150 mil) besitzt. 65” SOP – Exposed pad on underside; often used for power devices; SOIC packages range from 1. 27mm, those with a JEITA standard are SOP (Small Outline Package) and those with a JEDEC standard are SOIC (Small Outline Integrated Circuit). The difference between 150mil and 208mil is, that the 208mil package is about 1. 391 0. Meet all present and future national and international statutory requirements. 7 mm by 1. 41mm wide, pads are 0. This is why it’s essential to make sure you have an SOIC footprint that matches the exact dimensions and tolerances of the manufacturer’s package for the component you are using. It is one of the most commonly used surface mount packages. 46mm - 2 x 1. As a general guideline, thermal resistance of conductors is analogous to electrical resistances, that is copper is the best, TOP エンジニアの知恵袋 ICパッケージの種類 45. You have read previously that every package is built for a particular function. SoIC는 'System On Intergrated Chips'의 첫글자들을 딴 TSMC의 브랜드입니다. The VSSOP package does not have as much SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 Small-outline Package (SOP or SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less. 7 mm PDIP Pin count: 8 -24 pins SOIC VSSOP WQFN SOP TVSSOP WCSP SSOP SOT X2SON QSOP PiccoStar WSON TSSOP Jun 6, 2023 · SOIC封装和SOP（Small Outline Package）封装是两种常见的表面贴装技术（SMT）封装，它们之间的区别如下：引脚排列方式：SOIC封装的引脚是两排排列，而SOP封装的引脚是一排排列。SOIC封装的引脚通常位于封装的两侧，而SOP封装的引脚则在封装的一侧。 Dual-package layouts for SOIC SOIC to SON SOIC to SOT Figure 4. 2. III. 25 from the lead tip. 75mm to I was recently looking at some SPI SRAM chips at Mouser and noticed that a particular IC came in both a SOIC-8 and TSSOP-8 package. 7. 058 0. Learn the similarities and differences between SOIC and SSOP, two types of surface mount integrated circuits. 27mm or 0. 3 V version) Integrated 0. May 31, 2024 · TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. Find guidelines for PCB design, rework, reliability, thermal characteristics, and package dimensions. The SOIC is a plastic package, available in 6, 8, 10, 14, and 16 pin versions with a body width of 4 mm, and in 16, 20, 24 and 28 pin versions with a wider body of 7. They can have a few different variants: Jan 27, 2021 · 文章浏览阅读6. dimensions a and b are to be determined at datum h. dxf)： Land pattern Data in DXF Format; Land Pattern(. 45mm pads , 2 x 2. IC Package Types and Their Features. DIP (Dual In-line Package) DIP is a classic example of an IC package. SOIC Packages: Leading Modern Miniaturization. Apr 11, 2024 · Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. The body sizes are typically smaller than a standard package. Regularly and continuously improve the performance of our products, processes, distribution and A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Other, similar IC packages include TSOP (thin small-outline package) and TSSOP (thin-shrink small-outline package). 236 MS Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. 27mm lead pitch. SOIC packages are JEDEC-compliant, and come in a variety of body widths. Software Migration Guidelines 1. Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 0098) Jan 21, 2015 · The JEDEC version of the SOIC (a. Feb 21, 2021 · Also, note that you mixed up the part suffixes and the package drawing codes. Pin counts : 24, 28, 32, 40, 44 > - 표면실장의 대표적인 형태. These variants feature different physical dimensions while maintaining a consistent pin pitch of 1. SSOP lead counts range from 8 to 64. SOIC 패키지의 장점 Jun 9, 2023 · How are SOIC packages soldered onto a circuit board? SOIC packages are soldered onto a circuit board using surface-mount technology (SMT). The board area computation is based on a lead-tip to lead-tip distance of 6 mm (nominal) and a body dimension of 5 mm (maximum, excluding mold flash). 5 cm in 1 m actually 3. Publication IPC-7351 may have alternate designs. 06 - 0. The soldering process involves applying solder paste to the pads on the PCB, placing the SOIC package onto the pads, and then reflowing the solder to establish electrical and mechanical connections. SOIC: 496Kb / 4P: Both narrow and wide body versions available Amkor Technology: SOIC: 780Kb / 3P: ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based 12/21: SOIC: 411Kb / 2P: Silver Wirebonding 02/22: SOIC: 505Kb / 2P: SOIC (Small Outline IC Package) is a D0008A SOIC - 1. 05” lead pitch; SOJC – Wider plastic package with lead spacing up to 0. 75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 4214825/C 02/2019 NOTES: (continued) 6. 2. dimensions d and e1 are determined at the outer most extremes of the plastic body at datum h. 54 mm Height: 4. θJA. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. See full list on electronicsforu. IC 선택할 때 참고해 주십시오. 5 mΩ Conductor 1. 6mm，sop-8 的焊盘宽度是 0. A tiny outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package. SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. 825 - 1. Section 13 of the datasheet has dimensioned drawings of the two packages and an addendum lists the full part numbers of the various versions that are available to order. 80mm x 1. 300 Inch) 05-08-1620 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 10:09:03 AM On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOIC8-N package. Dual-package layouts for TSSOP TSSOP to SON TSSOP to SOT VSSOP package layout The VSSOP package has a smaller form factor than the TSSOP and SOIC packages, making it the smallest second-ary common-package option to use as a second source. 어려운 용어 같지만 차근차근 들여다보면 컨셉이 그리 어렵지는 않습니다. 015 - 0. 5 mm (wide body). 342 0. CT415 & CT418 (5. Board Assembly Recommendations (Gullwing) Share 05_00 | Nov 12, 2020 | PDF | 2. Small outline actually refers to IC p Shrink Small Outline Package (SSOP) is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. 25 millimeters. The SSOP (shrink small-outline package) is an even smaller version of SOIC packages. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 0 V version), CT416 & CT417 (3. 5 mm, whiile the DWW package is 10. They are on a . SOPs or Small Outline Packages are surface-mount packages that are smaller than SOIC packages and with pin pitches lesser than 1. We offer customers a broad integrated circuit (IC) packaging portfolio enabled by years of engineering innovation and expertise. It has a smaller body and smaller lead pitch than the standard SOIC package. One of the key features of an SOIC-8 package is its relatively Oct 27, 2017 · Part Selection: SOIC-8 Package: NE555 555 timer ICs SOIC-16 Package: MAX232 RS-232 driver/receiver ICs. Specification Comparison 1. Small-outline IC (SOIC) & Small-outline Package (SOP) DIP comes with the version SOIC and SOP wherein the lead spacing is relatively reduced so that it helps in space utilization on PCB. dimensions b and c apply to the flat section of the lead between 0. SOIC/ SO/ SOP (Component) Es la abreviatura de Smal Outline Integrated Circuit y corresponde al término utilizado para describir un encapsulado plástico de forma rectangular para componentes de montaje superficial, que tiene sus terminales de conexión tipo ala de Ganso ( Gull Wing ) ubicados a lo largo de dos lados opuestos. On an IC package, signals propagate in and out through the signal leads and return through the power SOIC SC-70 2 x 5 0. Compare the dimensions and characteristics of different SOIC variants and related packages. IC 패키지의 종류 대표적인 IC 패키지 일람입니다. 06 - Mar 8, 2007 · Der Dataflash ist laut Atmel im SOIC 8-Pin-Package. May 13, 2014 · They are generally available in the same pin-outs as their counterpart DIP ICs. k. Solo el primero contiene silicio fermiónico (fosilizado) y semiconductores fermiónicos (dieléctrico de neutrones, un semiconductor que consiste en metales aislados y átomos de carbono %PDF-1. 8w次，点赞36次，收藏256次。SO、SOP、SOIC封装详解(关于宽体、中体、窄体)第一篇一、简介SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一种表面贴装型封装。 SOIC-8 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. 25 (0. They are similar to SOIC packages but have a slightly different form factor. 4. It is one of the most commonly used surface mount packages today. SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. The specs seem identical but the price is different (not by much, but different). 3D Model Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 当社半導体パッケージのステップ形式3Dモデルと各種CADソフトウェア上でご使用いただけるJEITA ET-7501 Level3 に準じた参照用のランドパターンをダウンロードいただけます。 VSOP - Very Small Outline Package The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. 5. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V Devices 1. Title: Package Drawing - SO 24-Lead Plastic (Wide . SOIC packages have wider and longer dimensions to accommodate the higher pin count, while SOP packages are more compact and have a smaller footprint. Semiconductor & Storage Products Home Nov 4, 2010 · 8-pin soic package, 1. Jan 12, 2025 · Footprint Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOIC16-W package. That can sometimes 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions Advanced Power Electron AP2306AGEN-HF: 101Kb / 4P: Small Outline Package AP2318AGEN-HF: 64Kb / 4P: Small Outline Package AP2323AGN-HF: 104Kb / 4P: Small Package Outline AP2301N-HF: 65Kb / 4P: Small Package Outline AP2301EN-HF: 102Kb / 4P: Small Package Outline AP2307GN-HF Jul 3, 2020 · The GrabCAD Library offers millions of free CAD designs, CAD files, and 3D models. 0mm to 2. QFN IC Package. Learn about the SOIC package, a popular surface mount IC type with a rectangular shape and pins on both sides. Shrink SOP is leadframe based, plastic encapsulated package that are well suited for applications requiring optimum performance in IC packaging with compressed body size and tightened lead pitch. Compare the JEDEC and JEITA/EIAJ standards for SOIC dimensions and pin counts, and see the common applications of SOIC packages. Because of the current situation with low availability of semiconductors, I would prefer to have the option to use both SOIC 8 package options. Small Outline Package (SOP): Definition, Applications and Advantages. 65mm) up Sep 4, 2024 · Fig 1: A Small Outline IC (SOIC) package mounted with SMD technology. The most common IC package types include-DIP IC Package; 2. 東芝製品パッケージsoic16の外形図や包装情報がご覧いただけます。 The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. The part numbers on the packages are sometimes shortened to fit in the reduced area. Ich finde aber keine Spezifikation zu SO08 und habe damit auch keine Maße von dem Ding. It is also smaller and thinner than a TSOP with the same lead count. com Learn how to handle and assemble Freescale Small Outline Integrated Circuit (SOIC) package during Printed Circuit Board (PCB) assembly. These packages include traditional ceramic and leaded options and advanced chip scale packages (Quad Flat No Lead (), Wafer Chip Scale Package or Die-Size Ball Grid Array ()), using fine pitch wire bond and flip chip interconnects, with SiP, module, stacked and embedded die Oct 2, 2023 · 文章浏览阅读3. Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. 236 MS-012 14 0. 5 = 3. QFP -> TQFP, VQFP, LQFP; SOP -> PSOP, TSOP, TSSOP; SOT IC Package; 3. The standard SOIC package features include: Body size: Typically 1. 65 mm to 1. 9 mm between pad rows so-8 has 0. 10 to 0. 5mm. 65mm x 1. Lead Spacing: The lead spacing, or pitch, is another distinguishing factor. 006 0. The package total height is 1. 27mm，如下：有宽体的208mil的，管脚间距是1. SOP. Jul 21, 2017 · For example, look at the specified package height from the bottom of the pins to the top of the body. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. Package Converters. The ISO772x devices are high-performance, dual-channel digital isolators with 5000 VRMS (DW and DWV packages) and 3000 VRMS (D package) isolation ratings per UL 1577. 150 Inch) 05-08-1610 Author: Linear Technology Corporation Keywords: Packaging Created Date: 5/15/2012 10:08:36 AM 1. 패키지 양쪽에 Gull-Form의 Lead가 있는 표면 실장형 패키지 There are different types of IC packages, such as SOIC packages and dip packages. 27mm. Quarter Small Outline Package (QSOP) is an SOP with a pin pitch of 25mils(0 Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options. 반도체 상품 일람은 여기 단자 방향 실장형 단자 모양 대표적 이미지 약칭 정식 명칭 개요 한방향 삽입 실장형 직선형 SIP Single In-line Package 패키지의 긴변 쪽에 일렬로 리드를 8-pin DIP package, as well as the better SOIC packages. Apr 24, 2018 · = SOIC (Small Outline Integrated Circuit) (미국 JEDEC규격) < Pitch : 50MIL(1. 65mm or 0. Finally, it’s also worth noting that SOIC-8 packages are often more expensive than SO-8 chips. 05" (1. PG-DSO-8-803_Package Outline_02 Share. SOICs offer space savings, cost reduction, and improved electrical performance due to their compact size and surface-mount nature. Learn about the SOIC package, a surface-mounted IC with gull wing leads and various pin counts. SMD IC Package. Apr 13, 2023 · Learn about the Small Outline Integrated Circuit (SOIC) package, a surface-mount IC package with leads on two sides. Whether differences like these are "important" depend on your application. なお、SOICは『Small Outline Integrated Circuit』の頭文字をとったものであり、『SOL(Small Outline L-leaded package)』や『SO』と表記されることもあります。なお、ガルウィング形(L字形)のリードがパッケージの 4側面から出ているものは、 QFP(Quad Flat Package) と呼ばれていスモール・アウトライン (so) パッケージには、soic、sot、すべての sop スピン (sop、tssop、vssop/msop) など、さまざまなサイズと変化を持つデュアル・リードの表面実装構成が含まれています。 May 31, 2023 · Size: SOIC packages are generally larger than SOP packages. 简要信息如下：2. Their height is similar to SOIC package. Different Types of IC Packages Dual-in-line Package (DIP) This is the most common through-hole IC package used in circuits Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. SOIC has been widely used since the late ’70s. Dec 30, 2024 · SOP（Small Outline Package）封裝和SOIC（Small Outline Integrated Circuit）封裝之間的差異相對細微，實際上，SOIC 是 SOP 的一種具體類型。以下是它們的細微差別及是否可以混用的分析： 1. TOP 전문 지식 모음집 IC 패키지의 종류 45. Package height: Ranges from 1. xml)：Land pattern Data in JEITA LPB C-format The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Adafruit Industries, Unique & fun DIY electronics and kits GD25Q16 - 2MB SPI Flash in 8-Pin SOIC package : ID 4763 - These little chips are like miniature SSD drives for your electronics. 2mm between pad rows (edit: corrected, the pins are 0. Nov 26, 2010 · - SOIC, SOP(TSOP, SSOP, TSSOP), QFP, QFJ(PLCC), QFN, BGA (1) SOP - Small Outline Package. 236 MS-012 16 0. 2 mm 2. 064 0. Another smaller version of the SOIC is the SSOP. Because of surface-mount, easy assembly with better electrical Jun 30, 2021 · SOP/SOIC/SO (Small Outline Package) A surface mounts integrated circuit package is known as SOIC. The CT41x family is offered in an industry standard 8-lead SOIC package that is “green” and RoHS compliant. 9mm TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies. PDF 196 KB: 2022年4月26日 Mar 29, 2023 · The lead position of SOIC packages also allows for better electrical performance, as the leads have shorter paths to the IC. It should be clearly understood that these thermal resistances are highly package dependent, as different materials have different degrees of thermal conductivity. Nov 12, 2020 · Package. stp)： 3D model Data in STEP Format; Land Pattern(. Advantages of Ceramic SOIC: Multilayer Package ; Solder, Glass or Epoxy Seal Package Width: 26. 하지만 EIAJ a 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 5mm between pad rows dso has 0. In a presentation at the company's recent technology symposium, TSMC outlined a Jul 25, 2024 · For low power applications of that particular package. 8. 27mm。 Leadframe packages have long been an industry standard. May 29, 2023 · Small Outline Integrated Circuit - SOIC. lweg fowfa did vcsl leu bwron xcl xawtg thh ecifwy wbsnbf fam frgibz jlixhy gli